Automated Optical Inspection Instrument MF-830IL

Applicable PCB Applicable manufacturing process
Post reflow

PCB size  20*20mm～300*400mm

PCB thickness  0.5~3mm; bending amplitude ≤2.0mm

PCB clear height  up:≤30mm;down:≤60mm

Inspection Items
Post reflow
Component missing, excessive component, solder ball, solder misalignment, edge-on, tombstone, mounting side down, wrong polarity, wrong component, bad component, solder bridging, cold soldering, solder unavailability, insufficient solder, excessive solder, component up, IC pin up, IC pin bent

Vision System  Image pickup system  Color CCD

Illuminating system  Four-color LED ring light source

Resolution  15μm

Inspection principle  Color calculation, color extraction, grey-scale calculation, image contrast

Mechanic System  X/Y driving system  AC servo motor + precise ball lead-screw

Splint method  Bilateral Automated Fixture

Positioning accuracy  8μm

Moving speed  700mm/s(Max)

Track adjustment  Auto/Manual

Software System  Operating system  Windows 2000 OR Windows XP

Language  English & Chinese optional

Output  Substrate ID, substrate names, element name, name of defects, defect pictures, etc

Optional accessories  Offline programming system, SPC system, Barcode identification system, etc

Power supply  AC 220V ±10％, 50/60Hz, 1KW

Temperature range   -10-40℃

Ambient temperature  10-85％RH(frost free）

Dimensions 900×1000×1180mm