BGA Rework station DH-5830
เครื่องถอดชิพไอซี BGA Rework station DH-5830
BGA Rework station DH-5830
Motherboard BGA Repair Machine,BGA chip rework, Laptop BGA rework
Specification:
Power supply |
AC220V±10% 50/60Hz |
Power |
Max 4500 W |
Top heater |
Hot air 800W |
Bottom heater |
Hot air 1200W, Infrared 2400W |
Positioning |
V-groove, PCB support can be adjusted in any direction and with external universal fixture |
Temperature control |
K sensor closed loop control, independent heating |
Temp accuracy |
±3°C |
PCB size |
Max 355×335 mm Min 50×50 mm |
Workbench fine-tuning |
±15mm forward/backward, ±15mm right/left |
Placement Accuracy |
±0.01MM |
BGA chip |
2*2-80*80mm |
Minimum chip spacing |
0.15mm |
External Temperature Sensor |
1(optional) |
Machine dimension |
L535×W650×H600 mm |
NW |
30KG |
{youtube}l9DZvgjLyvE{/youtube}
- ติดต่อสอบถามโทร
- 081-318-9844 086-8831827,088-2740603,02-9330022