เครื่องยิง Laser ถอด IC PDR-X410
เครื่องยิง Laser ถอด IC PDR-X410
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PDR IR-X410 - Top of the range for BGA Rework
The advanced PDR IR-X410 SMT/BGA Rework System takes the repair of the latest PCB assemblies in its stride, easily overcoming the frustrations and complexities of 'high end' rework.
The system is tip/nozzle free, instantly and precisely controllable, clean and produces high quality BGA rework without any complications. It provides the extremely high levels of profiling and process control necessary for the effective rework of even the most advanced packages, including SMDs, BGAs, CSPs and Flipchips, and is ready for 0201 and lead-free applications.
The IR-X410 comes with a good range of standard features allowing the operator to quickly and safely rework all types of components without overheating the component, adjacents or the PCB. It's hands-free, semi-automated and comes with PDR's user-friendly ThermoActiv V3 software suite.
Ideal for the hidden interconnects in a high density environment
Produces 100% yield BGA rework without any complications
Instant, visible, highly controllable heating
Tool free and gas free
Modular and upgradeable
รายละเอียด:
Power Input: 110v/220v
แสงด้านบน Infrared 200C องศา
Heating Laser
แสงด้านล่าง Infrared 200CUp องศา
Heating Quartz Infrared
สามารถถอด Chip IC BGA MicroBGA
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